Program at a Glance
Last update : October 20, 2025
| Nov. 10 (Mon.) | Time | Room A (Capri Room, 2F) | Room D (Sydney Room, 2F) | 2F Lobby | ||
|---|---|---|---|---|---|---|
| 13:00-16:00 | Tutorial I
Current and Future Challenges and Solutions in AI & HPC System and Thermal Management Dr. Gamal Refai-Ahmed (AMD, USA) |
Registration | ||||
| 16:00-17:30 | Tutorial II
Non-Volatile Memory-Based AI Semiconductors for Low-Power Neural Networks Prof. Jong-Ho Lee (Seoul Nat'l Univ., Korea) |
Short Course (in Korean Language)
3D NAND Flash Technology Trends Prof. Sungnam Chang (Hanyang Univ. / PeDiSem Ltd., Korea) |
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| 18:15-20:00 | Welcome Reception (Sicily Room, 1F) | |||||
Plenary Session will be live streamed at Sydney Room (2F) and Sicily Room (1F).
| Nov. 11 (Tue.) | Time | Room A (Capri Room, 2F) |
Room B (Grand Ballroom 1, 2F) |
Room C (Grand Ballroom 3, 2F) |
Room D (Sydney Room, 2F) |
Room E (Sicily Room, 1F) |
Room F (Panorama Room, 16F) |
2F Lobby |
|---|---|---|---|---|---|---|---|---|
| 10:00-10:45 | Plenary Session I (Capri Room, 2F)
Semiconductor Technology Trends to Overcome the Integration Limitations for Future AI Memory Devices Dr. Jiho Kang (SK hynix Inc., Korea) |
Registration & Exhibition |
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| 10:45-11:00 | Coffee Break (2F Lobby) | |||||||
| 11:00-11:30 | Opening Ceremony (Grand Ballroom 1, 2, 3, 2F) | |||||||
| 11:30-13:00 | Lunch | |||||||
| 13:00-14:40 | TuA1 (Thin Film) | TuB1 (Etching) | TuC1 (MI) | TuD1 (Power) | TuE1 (CMP) | |||
| Nanoscale Thin Film Deposition I | Advanced Etchg I | Advanced Metrology & Inspection, Process Diagnostics & Control, and Yield Management I | Power Devices I | Innovative Abrasives and Carbon Layer CMP | ||||
| 14:40-14:50 | Coffee Break (2F Lobby) | |||||||
| 14:50-16:30 | TuA2 (Thin Film) | TuB2 (Etching) | TuC2 (MI) | TuD2 (Power) | TuE2 (CMP) | TuF2 (PKG) | ||
| Nanoscale Thin Film Deposition II | Sustainable Etch | Advanced Metrology & Inspection, Process Diagnostics & Control, and Yield Management II | Power Devices II | CMP Consumables: Conditioning, Monitoring, and Abrasives | Processing for 3D Integration | |||
| 16:30-16:40 | Break | |||||||
| 16:40-17:25 | Special Session I (Capri Room, 2F)
Why Semiconductor in the AI World? Chairman Chul Joo Hwang (Jusung Engineering Co., Ltd., Korea) |
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| 17:25-18:15 | Poster Session I (Grand Ballroom 4, 2F) | |||||||
| Nov. 12 (Wed.) | Time | Room A (Capri Room, 2F) |
Room B (Grand Ballroom 1, 2F) |
Room C (Grand Ballroom 3, 2F) |
Room D (Sydney Room, 2F) |
Room E (Sicily Room, 1F) |
Room F (Panorama Room, 16F) |
2F Lobby |
|---|---|---|---|---|---|---|---|---|
| 09:00-10:40 | WeA1 (Thin Film) | WeB1 (Etching) | WeC1 (MI) | WeD1(Litho) | WeE1 (CMP) | WeF1 (PKG) | Registration & Exhibition |
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| Nanoscale Thin Film Deposition III | HARC Etch and Plasma Source | Advanced Metrology & Inspection, Process Diagnostics & Control, and Yield Management III | LIthography Process | Nanostructured Materials and Surface Chemistry | Processing for AI Semiconductor Modules | |||
| 10:40-10:55 | Coffee Break (2F Lobby) | |||||||
| 10:55-11:40 | Plenary Session II (Capri Room, 2F)
Atomic Layer Processing: Status and Perspectives in Advancing Semiconductor Manufacturing Prof. Fred Roozboom (Univ. of Twente, The Netherlands) |
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| 11:40-13:10 | Lunch | |||||||
| 13:10-13:55 | Plenary Session III (Capri Room, 2F)
Pushing the Limits: A Decade of Thermo-Mechanical Breakthroughs in Semiconductor Packaging Dr. Gamal Refai-Ahmed (AMD, USA) |
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| 13:55-14:10 | Coffee Break (2F Lobby) | |||||||
| 14:10-15:50 | WeA2 (Thin Film) | WeB2 (Etching) | WeC2 (MI) | WeD2 (Litho) | WeE2 (CMP) | WeF2 (PKG) | ||
| Nanoscale Thin Film Deposition IV | Advanced Etch II | Advanced Metrology & Inspection, Process Diagnostics & Control, and Yield Management IV | Material & Process | AI-Driven CMP and Emerging Process Strategies | Materials and Processing for Advanced Packaging | |||
| 15:50-16:05 | Break | |||||||
| 16:05-17:45 | WeA3 (Thin Film) | WeD3 (Litho) | WeE3 (CMP) | WeF3 (PKG) | ||||
| Nanoscale Thin Film Deposition V | Computational Lithography & Mask | Reliability and Integration Challenges in Advanced Packaging | Advanced Designs, Processing, and Reliability | |||||
| 17:45-18:30 | Break | |||||||
| 18:30-20:30 | Banquet (Grand Ballroom, 2F) | |||||||
| Nov. 13 (Thu.) | Time | Room A (Capri Room, 2F) |
Room B (Grand Ballroom 1, 2F) |
Room C (Grand Ballroom 3, 2F) |
Room D (Sydney Room, 2F) |
Room E (Sicily Room, 1F) |
Room F (Panorama Room, 16F) |
2F Lobby |
|---|---|---|---|---|---|---|---|---|
| 09:00-10:40 | ThA1 (Thin Film) | ThB1 (Etching) | ThC1 (MI) | ThD1 (Litho) | ThE1 (CMP) | ThF1 (ESG) | Registration & Exhibition |
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| Nanoscale Thin Film Deposition VI | Atomic Scale Etching | Advanced Metrology & inspection, Process diagnostics & control, and Yield management V | Process & Mask | CMP for Heterogeneous Integration and New Materials | Carbon Neutrality in Semiconductor Industry I | |||
| 10:40-10:50 | Coffee Break (2F Lobby) | |||||||
| 10:50-12:30 | ThA2 (Thin Film) | ThB2 (Etching) | ThC2 (MI) | ThD2 (Litho) | ThE2 (CMP) | ThF2 (ESG) | ||
| Nanoscale Thin Film Deposition VII | Etch Process Monitoring | Advanced Metrology & inspection, Process diagnostics & control, and Yield management VI | Alternative Lithography | Next-Generation Slurries and Pad Technologies | Carbon Neutrality in Semiconductor Industry II | |||
| 12:30-14:00 | Lunch | |||||||
| 14:00-14:45 | Special Session II (Capri Room, 2F)
Memory Technology Trends and Outlook: DRAM, NAND, Emerging Memory Dr. Jeongdong Choe (TechInsights, Canada) |
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| 14:45-15:00 | Coffee Break (2F Lobby) | |||||||
| 15:00-15:45 | Plenary Session IV (Capri Room, 2F)
The Planarization Technology Innovations in the Era of 3D Ics Dr. Bo Un Yoon (Samsung Electronics Co., Ltd., Korea) |
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| 15:45-16:55 | Coffee Break (2F Lobby) | |||||||
| 15:55-16:45 | Poster Session II (Grand Ballroom 4, 2F) | |||||||
| 16:45-17:00 | Break | |||||||
| 17:00-17:30 | Closing Ceremony & Award Ceremony (Capri Room, 2F) | |||||||
| Nov. 14 (Fri.) | Time | Room A (Capri Room, 2F) |
Room B (Grand Ballroom 1, 2F) |
Room C (Grand Ballroom 3, 2F) |
Room D (Sydney Room, 2F) |
Room E (Sicily Room, 1F) |
Room F (Panorama Room, 16F) |
2F Lobby |
|---|---|---|---|---|---|---|---|---|
| 08:30-12:00 08:30-17:30 |
Optional Tour | |||||||
| Topic | Session |
|---|---|
| 1. Nanoscale Thin Film Deposition | TuA1, TuA2, WeA1, WeA2, WeA3, ThA1, ThA2 |
| 2. Advanced CMP & Cleaning | TuE1, TuE2, WeE1, WeE2, WeE3, ThE1, ThE2 |
| 3. Advanced Etching Technology | TuB1, TuB2, WeB1, WeB2, ThB1, ThB2 |
| 4. Advanced Lithography + Patterning | WeD1, WeD2, WeD3, ThD1, ThD2 |
| 5. Advanced Packaging Technology | TuF1, WeF1, WeF2, WeF3 |
| 6. Advanced Metrology & Inspection, Process Diagnostics & Control, and Yield Management | TuC1, TuC2, WeC1, WeC2, ThC1, ThC2 |
| 7. Power Semiconductor Devices and Manufacturing Process | TuD1, TuD2 |
| 8. Carbon Neutrality in Semiconductor Industry | ThF1, ThF2 |
| How to See the Session Codes | |||||
|---|---|---|---|---|---|
| Day of Week | Room | Session No. | Presentation No. | Presentation Code | |
| Tuesday | Tu | A | 1 | 1 | TuA1-1 |
| Wednesday | We | B | 2 | 2 | WeB2-2 |
| Thursday | Th | C | 3 | 3 | ThC3-3 |
