Mr. JongHo Lee

SK hynix, Korea

Innovations in Depostion Technologies at the onset of 3D Memory Devices

Dr. Kwangmin Park

Samsung Electronics Co., Ltd., Korea

Selective Atomic Layer Deposition in Advancing Semiconductor Manufacturing

Prof. Rong Chen

HUST, China

Multi-Threshold Voltage (Vth) Engineering using ALD TaN-based HKMG Gate Stack for Advanced Logic and DRAM Devices

Prof. Changhwan Choi

Hanyang Univ., Korea

High-Performance Transparent Conducting Oxides via Nano-Textured Substrates and Ag Interlayer

Prof. Young-Rae Cho

Pusan Nat’l Univ., Korea

Atomic Layer Deposition Process Development of Molybdenum Dioxide for the DRAM Capacitor Electrode Applications

Prof. Woojin Jeon

Kyung Hee Univ., Korea

Reactor-scale Modeling and AI-Surrogate Approaches for Thin Film and Bulk Crystal Growth: Oxide ALD, Diamond MPCVD, and SiC PVT

Dr. Seong-Min Jeong

KICET, Korea

2D Semiconductor Crystal Layer Deposition Toward Fab-Line Compatibility

Prof. Kibum Kang

KAIST, Korea

Transforming Semiconductor Manufacturing with AI: Changing the Paradigm of Next-Generation Semiconductor Processes

Dr. Jinwoo Kim

HEX A.I. Labs Inc., Korea

Ultrathin Freestanding Ceramic Membranes for Yield Enhancement in Extreme Ultraviolet Lithography

Dr. Seul-Gi Kim

KETI, Korea

Non-fluorinated Molybdenum Metallization in 3D NAND

Mr. Jungho Lee

Lam Research Korea, Korea

Novel Organic Molecular Inhibitors for Improved Step Coverage in High-Temperature ALD Dielectrics

Dr. Seunghyun Lee

Soulbrain Co., Ltd., Korea

Optimization of Atomic Layer Deposition Chemistry Toward Advanced Semiconductor Applications

Prof. Woo-Jae Lee

Pukyong Nat'l Univ., Korea

Atomically Ordered ALD Oxide Semiconductors for High-Mobility, Low-Temperature Logic and BEOL Integration

Prof. Jin-Seong Park

Hanyang Univ., Korea

Ferroelectric Materials for Low Power Electronic Devices and Computing

Prof. Min Hyuk Park

Seoul Nat'l Univ., Korea

Atomic Layer Deposition of Molybdenum Thin Films: Enhancing Deposition Characteristics and Film Quality with Advanced Deposition Materials

Dr. Changbong Yeon

Soulbrain Co., Ltd., Korea

Hybrid Bonding Challenges and Advanced CMP Strategies for Yield Enhancement

Dr. Haeri Kim

SK hynix, Korea

Wet Cleaning Process Issues with Memory Device Scaling down

Dr. Young-Hoo Kim

Samsung Electronics Co., Ltd., Korea

Dr. Nandan Kenchappa

Applied Materials, USA

3D Observation Method of Transporting Nano-Particle near a Surface

Prof. Panart Khajornrungruang

Kyushu Inst. of Tech., Japan

Slurry sensing for CMP processes

Prof. Min Ku Kim

Hanyang Univ., Korea

Prof. Tae-Dong Kim

Hannam Univ., Korea

New Pad for high rate and longer life in W bulk CMP

Dr. Ja-Eung Koo

DuPont, Korea/USA

Emerging CMP Solutions For Next Generation Advanced Packaging Process

Dr. Jae-Dong Lee

KC Tech Co., Ltd., Korea

CMP Pad Conditioning of the Future: Fundamentals, Emerging Technologies, and Development Pathways

Dr. Yongsik Moon

EHWA Diamond, Korea

Molybdenum CMP: Aspects of Thermodynamics and Kinetics

Prof. Ungyu Paik

Hanyang Univ., Korea

Surface Modification Mechanism of Carbon–Metal–Carbon Structures for Enhanced Mechanical Polishing Performance in Hard Amorphous Carbon Layer Chemical-Mechanical-Planarization

Prof. Jea-Gun Park

Hanyang Univ., Korea

A Novel CMP Slurry Systems for Next-Generation Semiconductor Fabrication

Dr. Sang Hyun Ryu

Dongjin Semichem Co., Ltd, Korea

Machine Learning-Based Strategic Corrosion Management for Targeted Inhibitor Implementation in CMP Applications

Prof. Jihoon Seo

Clarkson Univ., USA

Oxide Layer Engineering for Cobalt CMP

Prof. Taeseup Song

Hanyang Univ., Korea

Oxidation Behavior of Co Metal for CMP Slurry Design

Prof. Seho Sun

Yeungnam Univ., Korea

Challenges and Approaches of HARC Patterning for AI Memory Devices

Mr. Yeonghun Han

SK hynix, Korea

Next Generation HARC Etch Technologies Requiring Ultra-High Aspect Ratio, High Selectivity, and Very High Etch Rate for Vnand Device

Dr. Jaeho Min

Samsung Electronics Co., Ltd., Korea

Low-GWP Cyclic Etching of SiO2 Contact Holes Using Heptafluoropropyl Methyl Ether

Prof. Chang-Koo Kim

Ajou Univ., Korea

Development of an Endpoint Evaluation Sensor to Enhance Uniformity in Plasma Chamber Cleaning

Prof. Kyongnam Kim

Daejeon Univ.,Korea

Advanced Patterning of Metal Oxide Semiconductors for Memory Applications: IBE, RIE, and ALE Approaches

Dr. Jie Li

IMEC, Belgium

3D NAND Dielectric Etch Technology Challenges and Breakthroughs

Dr. Dongsoo Lee

Lam Research Korea, Korea

Prof. Hae June Lee

Pusan Nat’l Univ., Korea

Ab Initio Analysis of Atomistic Diffusion of Halogen Species at the Etching Front

Prof. Sangheon Lee

Ewha Womans Univ., Korea

Conversion-Free Atomic Layer Etching (ALE) of ZnO: Effect of Precursor on the ALE Process

Prof. Taewook Nam

Sejong Univ., Korea

Nonhalogen Etching for Hard-to-Etch Materials: A Concept Developed from Wet-like Plasma Technology for Semiconductor Device Fabrication

Prof. Thi-Thuy-Nga Nguyen

Nagoya Univ., Japan

EUV ECO Equal Maximizing Productivity

Mr. Heeyoul Lim

SK hynix, Korea

A Journey to the Future : Low & High NA EUV Lithography for Next Generation Logic Devices

Dr. Jong-Hwa Baek

Samsung Electronics Co., Ltd., Korea

EUV Mask Technology: Evolution and Future Outlook

CTO. Chan-Uk Jeon

Tekscend Photomask, Japan

Recent Progress in Tin-Based Inorganic Molecular Resists for EUV Lithography and Proposal of Cyclic Siloxane Resist for Blue-X Lithography

Prof. Hyun-Dam Jeong

Chonnam Nat’l Univ., Korea

Advanced Patterning: Tackling the Big Problems in Printing Small Features

Mr. Ben Eynon

Lam Research, USA

From Molecular Simulations to Artificial Intelligence for Advanced Patterning Materials Designs

Prof. Su-Mi Hur

Chonnam Nat'l Univ., Korea

Dynamic IR Beam Steering and Switching with Active Metasurfaces

Prof. Min Seok Jang

KAIST, Korea

EUV Mask Local CD Correction System Development via Laser Irradiation

Dr. Byeonggeun Kim

SEMES Co., Ltd., Korea

Cartridge-Based Van der Waals Printing for Versatile Device Integration

Prof. Dong Hyup Kim

Chonnam Nat'l Univ., Korea

Scalable Nanomanufacturing for Optical Metasurfaces

Prof. Inki Kim

Sungkyunkwan Univ., Korea

Nanopatterned Surfaces for Advanced Manipulation of Light

Prof. Soo Jin Kim

Korea Univ., Korea

Unlocking the Optical Potential of MXenes: Discoveries in Plasmonics and Nonlinear Absorption

Prof. Myung-Ki Kim

Korea Univ., Korea

SEM Overlay Target Optimization for NZO Improvement by measuring device like target using e-beam simulation

Mr. You Jin Kim

Applied Materials, Korea

OPC Modeling for Directional Etch Process

Dr. Young-Chang Kim

SIMENS, USA

Understanding of Novel Patterning Materials Approacing to Next Gen Lithography

Dr. Ethan C B Lee

Samsung SDI, Korea

EUV vs. E-Beam Photoresists : Cross-Platform Analysis and Optimization Strategies

Mr. Hyungkun Lee

Dongjin Semichem Co., Ltd, Korea

Development of EUV Pellicles Supporting High EUV Power

Dr. Prashant Purwar

S&STECH, Korea

EUV and High-NA EUV Patterning for DRAM Scaling: Challenges and Opportunities

Mr. Jeonghoon Lee

Imec, Belgium

MBM-4000; Electron Multi-Beam Mask Writer for Advanced Mask Making

Ms. Rieko Nishimura

NuFlare Tech. Inc., Japan

Large Scaled Metasurface Design and Fabrication for Terahertz Electromagnetic Wave Modulation and Their Applications

Minah Seo

Sogang Univ., Korea

Vertical Fan-Out (VFO) Technology for Memory and Storage Applications

Dr. Ji Yong Park

SK hynix, Korea

Challanges of hybrid Cu bonding for high bandwitdh memory

Mr. Jae-wha Park

Samsung Electronics Co., Ltd., Korea

Statistical Signal Integrity Analysis with Nonideal Buffer of DFE for Chiplet

Prof. Junyong Park

Kyung Hee Univ., Korea

Development of Optical Interconnection Core Technologies for Implementation and Reliability Enhancement of Co-Packaged Optics

Prof. Hongyun So

Hanyang Univ., Korea

Trend in Advanced Package Inspection and Metrology Technologies

Mr. JongKwan Kim

SK hynix, Korea

The Future Is Here: Next-Gen Semiconductor Metrology & Inspection

Dr. Taeyong Jo

Samsung Electronics Co., Ltd., Korea

A New Approach to High-throughput Defect Review of Unpatterned Wafers for Leading Edge Nodes

Dr. Ali Ozhan Altun

UNISERS, Swiss

Applications of High-Speed AFM for Advanced Packaging, EUV Lithography and CMP

Dr. Devin Giddings

Infinitesima Limited, UK

Development of DUV & EUV Optics for Semiconductor Inspection

Dr. Hagyong Kihm

KRISS, Korea

Advances in plasma diagnostics for process chamber monitoring and characterization: Microwave diagnostics

Dr. Dae-Woong Kim

KIMM, Korea

Wafer Fracture Stress due to Edge Cracks and Crack Inspection Method

Dr. Hyun-Jung Kim

Nexus1 Co., Ltd., Korea

Development of Designing Motion Profile with Advanced Jerk for Vibration Suppression and High Wafer throughput

Dr. Janghwan Kim

SEMES Co., Ltd., Korea

The Importance and Role of MI in Semiconductor Devices' 3D Era

Dr. Byoung-Ho Lee

Hitachi-hightech, Japan

Mr. Trevor Norman

Axiomatique Technologies, UK

X-ray Metrology for Devise Nanostructure of Advanced Electronics

Dr. Kazuhiko Omote

Rigaku Corporation, Japan

Development of a High-Brightness LaB6 Electron Source and REELS

Dr. In-Yong Park

KRISS, Korea

Overlay Metrology for Layer Alignment Accuracy in Device Processing

Dr. Nahee Park

KLA Corp., USA

Data-driven plasma science-based plasma etching process design in OLED and Semiconductor mass productions referring to PI-VM

Dr. Seolhye Park

Samsung Display Co., Ltd., Korea

Next-Generation Optical Metrology for Advanced Semiconductor Packaging

Dr. Joonho You

Nexensor Inc., Korea

III-N Heterojunction Devices for Power Electronics and Extreme Environment Applications

Prof. Ho-Young Cha

Hongik Univ., Korea

Cosmic-Ray Radiation Effects on Power Devices

Dr. Dong-Seok Kim

KAERI, Korea

Development status of SiC MOSFET in Powermaster Semiconductor

Dr. Hong-ki Kim

Powermaster Semiconductor, Korea

Possibility of AlN/GaN/AlN Heterostructure for Power Device Applications

Prof. Jeong-Gil Kim

Dong-A Univ., Korea

Fabrication of SiC SBD for 6.5kV Edge‑Termination Designs

Dr. Sungmo Koo

EYEQ Lab, Korea

Power Semiconductor Packaging Using Ceramic Clip

Mr. Dongkwang Lee

Semipower Inc., Korea

Design and Evaluation of High-Reliability Edge Termination Structures for 1.2 kV SiC Power Devices

Prof. Ogyun Seok

Pusan Nat'l Univ., Korea

Toward Sustainability: Green CVD Approaches for Decarbonizing Semiconductor Fabs

Mr. Chulhwan Choi

Samsung Electronics, Korea

Improvement of PFC Gas Treatment Technology for Etching Using Catalysts and Its Additional Effects

Dr. Yongjin Kim

ECOENERGEN Ltd., Korea

Estimating GWP Based on a Comprehensive Analysis of R134a: A Method for Accurate Monitoring of Greenhouse Gas Emissions

Dr. Jeongsoon Lee

KRISS, Korea