Invited Speakers

KISM 2025 BUSAN Topics
1. Nanoscale Thin Film Deposition	2. Advanced CMP & Cleaning
3. Advanced Etching Technology	4. Advanced Lithography + Patterning
5. Advanced Packaging Technology	6. Advanced Metrology & Inspection, Process Diagnostics & Control, and Yield Management
7. Power Semiconductor Devices and Manufacturing Process	8. Carbon Neutrality in Semiconductor Industry

1. Nanoscale Thin Film Deposition

Mr. JongHo Lee

SK hynix, Korea
Innovations in Depostion Technologies at the oneset of 3D Memory Devices

Dr. Kwangmin Park

Samsung Electronics Co., Ltd., Korea

Bio

2. Advanced CMP & Cleaning

Mr. SangChul Kim

SK hynix, Korea
Wet Cleaning Process Issues with Memory Device Scaling down

Dr. Young-Hoo Kim

Samsung Electronics Co., Ltd., Korea

Bio
Dr. Nandan Kenchappa

Applied Materials, USA
Prof. Panart Khajornrungruang

Kyushu Inst. of Tech., Japan
Slurry sensing for CMP processes

Prof. Min Ku Kim

Hanyang Univ., Korea

Bio
Prof. Tae-Dong Kim

Hannam Univ., Korea
Dr. Ja-Eung Koo

DuPont, Korea/USA

Bio
Prof. Ungyu Paik

Hanyang Univ., Korea
Prof. Jae-gun Park

Hanyang Univ., Korea
Dr. Sang Hyun Ryu

Dongjin Semichem Co., Ltd, Korea

Bio
Machine Learning-Based Strategic Corrosion Management for Targeted Inhibitor Implementation in CMP Applications

Prof. Jihoon Seo

Clarkson Univ., USA

Bio
Prof. Seho Sun

Yeungnam Univ., Korea

3. Advanced Etching Technology

Mr. Yeonghun Han

SK hynix, Korea
Dr. Jaeho Min

Samsung Electronics Co., Ltd., Korea
Dr. Jie Li

IMEC, Belgium

Bio
Dr. Dongsoo Lee

Lam Research Korea, Korea

Bio
Low temperature atomic layer etching of zinc oxide (ZnO): Effects of conversion reaction on metal oxide ALE

Prof. Taewook Nam

Sejong Univ., Korea

Bio

4. Advanced Lithography + Patterning

Mr. HeeYoul Lim

SK hynix, Korea
Dr. Jong-Hwa Baek

Samsung Electronics Co., Ltd., Korea
Mr. Hyungkun Lee

Dongjin Semichem Co., Ltd, Korea

Bio

5. Advanced Packaging Technology

Dr. JiYoung Park

SK hynix, Korea
Challanges of hybrid Cu bonding for high bandwitdh memory

Mr. Jae-wha Park

Samsung Electronics Co., Ltd., Korea

Bio

6. Advanced Metrology & Inspection, Process Diagnostics & Control, and Yield Management

Mr. JongKwan Kim

SK hynix, Korea
The Future Is Here: Next-Gen Semiconductor Metrology & Inspection

Dr. Taeyong Jo

Samsung Electronics Co., Ltd., Korea

Bio
A New Approach to High-throughput Defect Review of Unpatterned Wafers for Leading Edge Nodes

Dr. Ali Ozhan Altun

UNISERS, Swiss

Bio
Dr. Hagyong Kihm

KRISS, Korea

Bio
Dr. Dae-Woong Kim

KIMM, Korea

Bio
The Role and Direction of MI in the 3D era

Dr. Byoung-Ho Lee

Hitachi-hightech, Japan

Bio
Mr. Trevor Norman

Axiomatique Technologies, UK
Dr. Nahee Park

KLA Corp., USA

Bio

7. Power Semiconductor Devices and Manufacturing Process

III-N Heterojunction Devices for Power Electronics and Extreme Environment Applications

Prof. Ho-Young Cha

Hongik Univ., Korea

Bio
Cosmic-Ray Radiation Effects on Power Devices

Dr. Dong-Seok Kim

KAERI, Korea

Bio
Development status of SiC MOSFET in Powermaster Semiconductor

Dr. Hong-ki Kim

Powermaster Semiconductor, Korea

Bio
Dr. Sungmo Koo

EYEQ Lab, Korea

Bio

8. Carbon Neutrality in Semiconductor Industry

Dr. Jeongsoon Lee

KRISS, Korea

Bio

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